#TI BLUETOOTH LE POWER CALCULATION TOOL SOFTWARE#
#TI BLUETOOTH LE POWER CALCULATION TOOL FREE#

View all 28Д¬C256x Dual-Mode Bluetooth Controller datasheet (Rev. In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

Several Bluetooth LE profiles and services.

Audio/video remote control profile (AVRCP).

Advanced audio distribution profile (A2DP).

Some of the profiles supported include the following: For more information, see TI Dual-Mode Bluetooth Stack.

#TI BLUETOOTH LE POWER CALCULATION TOOL SOFTWARE#

iPodВ® (MFi) protocol is supported by add-on software packages. Other MPUs can be supported through TIВ’s third party.

#TI BLUETOOTH LE POWER CALCULATION TOOL FREE#

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TIВ’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Furthermore, TIВ’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Based on TIВ’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Open-in-new Find other Bluetooth products

Device Pin-to-Pin Compatible With Previous.

CC256x Bluetooth Hardware Evaluation Tool: PC-Д«ased Application to Evaluate RF Performance of.

Into Various Microcontrollers, Such as MSP430в„ў

Flexibility for Easy Stack Integration and Validation.

Fully Programmable Digital PCM-I2S Codec.

Three-Wire UART Transport Layer (H5) With.

UART Interface With Support for Maximum.

Shutdown and Sleep Modes to Minimize Power.

Low Power Consumption for Active, Standby,.

On-Chip Power Management, Including Direct.

Provides Longer Range, Including 2x Range.

Improved Adaptive Frequency Hopping (AFH).

Best-in-Class Bluetooth (RF) PerformanceД¬ompensation to Ensure Minimal Variation in.

Built-In Coexistence and Prioritization Handling.

Independent Buffering for LE Allows Large.

Multiple Sniff Instances Tightly Coupled to.

Support of Up to 10 (CC2564B) Connections.

Support of Multiple Bluetooth Profiles With.

(WBS) Profile or A2DP Profile to Reduce Host

Variable Slope Delta (CVSD), A-Law, Вµ-Law,ДЄssisted Mode for HFP 1.6 Wideband Speech Support for All Voice Air-Coding вЂ“ Continuously.Scatternet: Up to 3 Piconets Simultaneously, 1.Package Footprint: 76 Terminals, 0.6-mm Pitch,.Qualified (QDID 58852) Compliant up to the HCI CC2564 Bluetooth 4.1 Controller Subsystem.TIвЂ™s Single-Chip Bluetooth Solution With BluetoothД«asic Rate (BR), Enhanced Data Rate (EDR), and.

Ti bluetooth le power calculation tool